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Gas-timing method for depositing oxynitride films by reactive R.F. magnetron sputtering

Product: Gas-timing method for depositing oxynitride films by reactive R.F. magnetron sputtering

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  • National patents: US
  • Publication number: US20090026065 A1
  • Application number: US 11/878,270
  • Publication date: Jan.29, 2009
  • Filing date: Sep. 23, 2007
  • Patent number: US8372250 B2
  • Date of Patent: Jan. 29, 2009
  • Inventors: Jiti Nukeaw, Bangkok, Supanit Porntheeraphat, Apichart Sungthong
  • Original Assigne: National Science And Technology Development Agency
  • Status: Patented

ABSTRACT:

A gas-timing control method for depositing metal oxynitride and transition metal oxynitride (Mx(ON)y) films on glass and flexible substrates using reactive radio frequency magnetron sputtering, without substrate heating. A system includes a sputtering chamber, substrates, targets, three mass flow controllers controlled respective flow rates of argon, nitrogen and oxygen gases alternately and intermittently into the sputtering chamber, and a radio frequency generator with 13.56 MHz which irradiated in the sputtering chamber to decompose sputtering gases. The flow rate ratio of oxygen+nitrogen/argon is at least 0.02, the flow rate ratio of oxygen/nitrogen is at least 0.01, and the sequence timing of argon, nitrogen and oxygen gases alternately or mixed into the sputtering chamber at least 1 sec.

Gas-timing depositing oxynitride films magnetron sputtering research NECTEC Patents

Publication date June-30-2016 08:55